KEEPING PACE WITH THE OPTIONS IN IC PACKAGING.

被引：0
|
作者：
Marks, Richard L. [1 ]
机构：
[1] AMP Inc, Harrisburg, PA, USA, AMP Inc, Harrisburg, PA, USA
来源：
Design News (Boston) | 1985年 / 41卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
INTEGRATED CIRCUITS
引用
收藏
页码：139 / 142
相关论文
共 50 条
  • [41] Highly transparent PP packaging.
    Schlotmann, R
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 868 - 869
  • [42] TOLERANCE ANALYSIS IN ELECTRONIC PACKAGING.
    Velsher, B.
    Electronic Packaging and Production, 1987, 27 (04): : 76 - 78
  • [43] HIGH DENSITY ELECTRONICS PACKAGING.
    Schwartz, Walter H.
    Assembly engineering, 1988, 31 (02): : 30 - 33
  • [44] STRESS ANALYSIS IN ELECTRONIC PACKAGING.
    Engel, P.A.
    Lim, C.K.
    Finite elements in analysis and design, 1988, 4 (01) : 9 - 18
  • [45] PLASTICS AND METALS: CHOICES IN PACKAGING.
    Heathcoat, M.J.
    Sheet Metal Industries, 1988, 65 (05): : 251 - 252
  • [46] DNA condensation and viral packaging.
    Gelbart, WM
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 : U248 - U248
  • [47] PHYSICAL DESIGN AND PACKAGING - 4. MATERIALS FOR PACKAGING.
    Brooks, Phil
    EDN, 1973, 18 (20) : 56 - 61
  • [48] Keeping PACE with the market
    Gilmore, Dean
    World Class Design to Manufacture, 1994, 1 (01): : 12 - 16
  • [49] KEEPING PACE WITH REALITY
    Flumerfelt, George
    CANADIAN MINING JOURNAL, 2009, 130 (01) : 14 - 15
  • [50] Keeping pace with innovation
    不详
    MICROWAVES & RF, 2000, 39 (10) : A8 - +
12345