Diffusion bonding of Al2O3 with Ti through Ti + TiH2 interfaces

被引：0
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作者：
Wlosinski, Wladyslaw K. [1 ]
机构：
[1] Warsaw Technical Univ, Warsaw, Poland
来源：
International Journal of Materials and Product Technology | 1995年 / 10卷 / 1-2期
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页码：152 / 160
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