Thick-film Hybrid Microcircuit Materials and Technologies.

被引：0

作者：

Nowak, Stanislaw

机构：

来源：

Elektronika Warszawa | 1981年 / 22卷 / 02期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUITS, HYBRID

引用

页码：21 / 25

共 50 条

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HOWARD, NA
[J]. IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1985, 32 (01): : 86 - 86
[32] TOOLSET TARGETS THICK-FILM HYBRID CIRCUITS
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[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) : C87 - C87
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[J]. SOLID STATE TECHNOLOGY, 1968, 11 (06) : 29 - +
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[37] CONTROLLED QUALITY TESTING OF MATERIALS USED IN THICK-FILM MATERIALS
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[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (09): : 944 - 944
[38] PLANNING FOR MANUFACTURE OF THICK-FILM HYBRID CIRCUITS IN INDIA
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[J]. ELECTRONICS INFORMATION & PLANNING, 1978, 5 (06): : 428 - 449
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[J]. 1978, 24 (04): : 702 - 713