MULTILAYER SUBSTRATES UTILIZING THIN-FILM AND THICK-FILM TECHNOLOGIES

被引：0
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作者：
CLOSE, AD
机构：
来源：
SOLID STATE TECHNOLOGY | 1971年 / 14卷 / 05期
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：38 / &
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