共 50 条
- [43] Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 2011, 462-463 : 530 - +
- [45] Polarity of electromigration at the interface between SnPb solder joints and Ni/Au finishes Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2010, 39 (02): : 254 - 257
- [48] Dominant migration element in electrochemical migration of eutectic SnPb solder alloy 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 621 - +
- [49] Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes Journal of Materials Research, 2008, 23 : 2017 - 2022