Electromigration behavior of eutectic SnPb solder

被引:0
|
作者
Choi, Jae-Young [1 ]
Lee, Sang-Su [1 ]
Joo, Young-Chang [1 ]
机构
[1] Sch. of Mat. Science and Engineering, Seoul National University, Seoul 151-742, Korea, Republic of
关键词
D O I
10.1143/jjap.41.7487
中图分类号
学科分类号
摘要
8
引用
收藏
页码:7487 / 7490
相关论文
共 50 条
  • [1] Electromigration behavior of eutectic SnPb solder
    Choi, JY
    Lee, SS
    Paik, JM
    Joo, YC
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 417 - 420
  • [2] Electromigration behavior of eutectic SnPb solder
    Choi, JY
    Lee, SS
    Joo, YC
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2002, 41 (12): : 7487 - 7490
  • [3] Electromigration in eutectic SnPb solder lines
    Huynh, QT
    Liu, CY
    Chen, C
    Tu, KN
    JOURNAL OF APPLIED PHYSICS, 2001, 89 (08) : 4332 - 4335
  • [4] Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples
    Guangchen Xu
    Fu Guo
    Zhidong Xia
    Yongping Lei
    Yaowu Shi
    Xiaoyan Li
    Journal of Materials Engineering and Performance, 2010, 19 : 616 - 622
  • [5] Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples
    Xu, Guangchen
    Guo, Fu
    Xia, Zhidong
    Lei, Yongping
    Shi, Yaowu
    Li, Xiaoyan
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2010, 19 (05) : 616 - 622
  • [6] Critical length of electromigration for eutectic SnPb solder stripe
    Wei, CC
    Chen, C
    APPLIED PHYSICS LETTERS, 2006, 88 (18)
  • [7] Threshold current density of electromigration in eutectic SnPb solder
    Yeh, YT
    Chou, CK
    Hsu, YC
    Chen, C
    Tu, KN
    APPLIED PHYSICS LETTERS, 2005, 86 (20) : 1 - 3
  • [8] Electromigration of eutectic SnPb solder interconnects for flip chip technology
    Lee, TY
    Tu, KN
    Kuo, SM
    Frear, DR
    JOURNAL OF APPLIED PHYSICS, 2001, 89 (06) : 3189 - 3194
  • [9] Electromigration at the high-Pb-eutectic SnPb solder interface
    Lai, CL
    Lin, CH
    Chen, C
    JOURNAL OF MATERIALS RESEARCH, 2004, 19 (02) : 550 - 556
  • [10] Microstructure evolution during electromigration in eutectic SnPb solder bumps
    Lu, CM
    Shao, TL
    Yang, CJ
    Chen, C
    JOURNAL OF MATERIALS RESEARCH, 2004, 19 (08) : 2394 - 2401