SMT without solder paste

被引：0
|
作者：
Keeping, Steven
机构：
来源：
| 1600年 / Angel Publishing Ltd, London, United Kingdom卷 / 23期
关键词：
Surface mount technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] SOLDER PASTE - TACK AND CURE
    KEVRA, J
    MOHORIC, D
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 313 - 319
  • [42] Solder paste reflow modeling
    Mannan, SH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (01) : 18 - 23
  • [43] Solder paste process control
    Clark, David J.
    Circuits Assembly, 1995, 6 (01):
  • [44] Buyers' guide - Solder paste
    Anon
    EP Electronic Production (London), 2002, 31 (05):
  • [45] TESTING THE QUALITY OF SOLDER PASTE
    SCHEIFFARTH, S
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1991, 99 (03): : 99 - 103
  • [46] Advancements in solder paste dispensing
    ASYMTEK
    SMT Surf Mount Technol Mag, 2008, 7 (10-15): : 10 - 15
  • [47] The solder paste factor in printing
    Las Marias, Stephen, 2016, PennWell Publishing Co. (31):
  • [48] Research on SMT Solder Joint Image Segmentation
    Sun Yaqi
    Liu Yu
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1288 - 1290
  • [49] Magnitude and location of strain in SMT solder joints
    Grossmann, G
    Affolter, C
    MICRO MATERIALS, PROCEEDINGS, 2000, : 448 - 451
  • [50] Hi-rel SMT solder joints
    Engelmaier, Werner
    Circuits manufacturing, 1988, 28 (12):
12345