SMT without solder paste

被引：0
|
作者：
Keeping, Steven
机构：
来源：
| 1600年 / Angel Publishing Ltd, London, United Kingdom卷 / 23期
关键词：
Surface mount technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Conductive adhesive -: an alternative to solder in SMT
    Mündlein, M
    Nicolics, J
    Gehberger, E
    Hainzl, H
    24TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: CONCURRENT ENGINEERING IN ELECTRONIC PACKAGING, CONFERENCE PROCEEDINGS, 2001, : 20 - 25
  • [22] SMT INTERCONNECTIONS EVOLVE BEYOND SOLDER
    GRANITZ, D
    ELECTRONIC DESIGN, 1994, 42 (04) : 131 - &
  • [23] Reliability of solder joint and SMT assembly
    Sandera, J
    2005 Spanish Conference on Electron Devices, Proceedings, 2005, : 73 - 76
  • [24] Solder process for fluxless solder paste applications
    Hanss, Alexander
    Hutter, Matthias
    Trodler, Joerg
    Elger, Gordon
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 447 - 454
  • [25] An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing
    Busek, David
    Uricar, Jonas
    Pilnaj, Dominik
    2024 47TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, ISSE 2024, 2024,
  • [26] BOARD INSPECTION - SOLDER PASTE VS SOLDER JOINT
    GAMBLE, C
    EE-EVALUATION ENGINEERING, 1995, 34 (08): : 20 - 22
  • [27] Solder, solder paste and flux, brazing alloys and flux
    Anon
    Assembly, 2001, 44 (07):
  • [28] Vibration fatigue experiments of SMT solder joint
    Wang, H
    Zhao, M
    Guo, Q
    MICROELECTRONICS RELIABILITY, 2004, 44 (07) : 1143 - 1156
  • [29] SOLDER MASK SELECTION FOR SMT BOARDS.
    Tilsley, G.M.
    Axon, F.J.
    Fisher, Larry
    Circuits manufacturing, 1988, 28 (06):
  • [30] Solder paste for no clean reflow
    Fenner, M.
    Soldering and Surface Mount Technology, 1993, (13): : 56 - 59
12345