Preparation of nanoporous silica films with low dielectric constant

被引:0
|
作者
Wang, Juan
Zhang, Changrui
Feng, Jian
机构
[1] State Key Lab of Novel Ceramic Fibers and Composites, National Univ. of Defense Technology, Changsha 410073, China
[2] State Key Lab of Novel Ceramic Fibers and Composites, College of Aerospace and Material Engineering, National Univ. of Defense Technology, Changsha 410073, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] New Polyimide and Nanoporous Structures with Low Dielectric Constant
    Mehdipour-Ataei, Shahram
    Aram, Elham
    ADVANCES IN POLYMER TECHNOLOGY, 2014, 33 (03)
  • [32] The development of low dielectric constant films
    Wang, J
    Zhang, CR
    Feng, J
    PROGRESS IN CHEMISTRY, 2005, 17 (06) : 1001 - 1011
  • [33] Low dielectric constant fluorocarbon films
    Lau, KKS
    Gleason, KK
    PLASMA DEPOSITION AND TREATMENT OF POLYMERS, 1999, 544 : 209 - 220
  • [34] Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion
    Zhang, Panpan
    Zhang, Lize
    Zhang, Ke
    Zhao, Jiupeng
    Li, Yao
    CRYSTALS, 2021, 11 (11)
  • [35] Preparation of ultra-low dielectric constant silica/polyimide nanofiber membranes by electrospinning
    Liu, Leipeng
    Lv, Fengzhu
    Li, Penggang
    Ding, Ling
    Tong, Wangshu
    Chu, Paul K.
    Zhang, Yihe
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2016, 84 : 292 - 298
  • [36] Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
    Lin, Qinghuang
    Cohen, Stephen A.
    Gignac, Lynne
    Herbst, Brian
    Klaus, David
    Simonyi, Eva
    Hedrick, Jeffrey
    Warlaumont, John
    Lee, Hae-Jeong
    Wu, Wen-Li
    JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2007, 45 (12) : 1482 - 1493
  • [37] Stress development in low dielectric constant silica films during drying and heating process
    Lu, MC
    Brinker, CJ
    THIN FILMS-STRESSES AND MECHANICAL PROPERTIES VIII, 2000, 594 : 463 - 468
  • [38] Stress development in low dielectric constant silica films during drying and heating process
    Lu, Mengcheng
    Brinker, C. Jeffrey
    Materials Research Society Symposium - Proceedings, 2000, 594 : 463 - 468
  • [39] Preparation of ultralow dielectric-constant porous silica films using Tween 80 as a template
    Ting, CY
    Ouyan, DF
    Wan, BZ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (08) : F164 - F167
  • [40] Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging
    Jiang, Jisu
    Keller, Landon
    Kohl, Paul A.
    JOURNAL OF ELECTRONIC PACKAGING, 2020, 142 (01)