Effects of assembly methodology on manufacturing induced stresses in μBGA packages

被引：0
|
作者：
Tsao, Pei-Haw [1 ]
Chen, Chun-Liang [1 ]
Huang, Yu-Jen [1 ]
Huang, Chender [1 ]
机构：
[1] Vanguard Int Semiconductor Corp, Hsinchu, Taiwan
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：653 / 656
相关论文
共 50 条
  • [1] Effects of assembly methodology on manufacturing induced stresses in μBGA packages
    Tsao, PH
    Chen, CL
    Huang, YJ
    Huang, C
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 653 - 656
  • [2] Flip chip assembly for BGA semiconductor packages
    LSI Logic Corp
    Natl Electron Packag Prod Conf Proc Tech Program, (1433-1438):
  • [3] ASSEMBLY-LEVEL RELIABILITY - A METHODOLOGY FOR EFFECTIVE MANUFACTURING OF IC PACKAGES
    NGUYEN, LT
    FINNELL, JR
    SINGH, KM
    IEEE TRANSACTIONS ON RELIABILITY, 1995, 44 (01) : 14 - 18
  • [4] BGA Strip Warpage Induced by Assembly Process and the Practical Prediction Methodology
    Duca, Roseanne
    Luan, Jing En
    Hla, Phone Maw
    Villa, Claudio Maria
    Rovitto, Marco
    2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2018,
  • [5] Vibration Induced Fatigue Reliability of BGA Packages
    Hsu, Yao
    Kong, Wei-Kuo
    Su, Chih-Yen
    Wu, Wen-Fang
    Liu, Ming-Wei
    2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 305 - +
  • [6] Induction Heating of Solder Ball Leads for Assembly of BGA Packages
    Lanin, V. L.
    Sergachev, I. I.
    Khot'kin, V. T.
    SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY, 2015, 51 (02) : 162 - 166
  • [7] Modeling the power and ground effects of BGA packages
    Caggiano, M.F.
    DelGiudice, B.
    Proceedings - Electronic Components and Technology Conference, 1999, : 1083 - 1087
  • [8] Modeling the power and ground effects of BGA packages
    Caggiano, MF
    DelGiudice, B
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 1083 - 1087
  • [9] Modeling the power and ground effects of BGA packages
    Caggiano, MF
    DelGiudice, B
    Tornquist, KJ
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 156 - 163
  • [10] Assembly and reliability of thermally enhanced high I/O BGA packages
    Ejim, TI
    Hollesen, DB
    Holliday, A
    Gahr, SA
    Coyle, RJ
    TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 25 - 31
12345