IMPROVED SOLDER JOINTS FOR SURFACE MOUNTING LEADLESS CHIP CARRIERS TO PRINTED WIRE BOARDS.

被引：0
|
作者：
Erich, J.S.
Sherry, W.M.
机构：
来源：
Technical Digest - Western Electric Company | 1983年 / 71期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：11 / 12
相关论文
共 50 条
  • [31] THE EFFECT OF JOINT DESIGN ON THE THERMAL FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS
    SHERRY, WM
    ERICH, JS
    BARTSCHAT, MK
    PRINZ, FB
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04): : 417 - 426
  • [32] Leachability of printed wire boards containing leaded and lead-free solder
    Townsend, Timothy
    Musson, Stephen
    Dubey, Brajesh
    Pearson, Brian
    JOURNAL OF ENVIRONMENTAL MANAGEMENT, 2008, 88 (04) : 926 - 931
  • [33] WIRE-BONDING CHIPS TO BOARDS MAY SPEED SURFACE MOUNTING
    不详
    ELECTRONICS, 1986, 59 (19): : 33 - 34
  • [34] Chip Implementation on Hybrid Circuits and Printed Wiring Boards. Use of Automatic Machinery Constructed of Modules.
    Friedrich, D.
    Elektronik Produktion & Prueftechnik, 1981, (10): : 531 - 535
  • [35] EPOXY CALLED BETTER THAN CONVENTIONAL SOLDER FOR SURFACE-MOUNTING COMPONENTS ON BOARDS
    LYMAN, J
    ELECTRONICS, 1984, 57 (11): : 46 - 46
  • [36] Infrared solder joint inspection on surface mount printed circuit boards
    Liu, RZ
    Shi, YQ
    Kosonocky, WF
    Higgins, FP
    38TH MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, PROCEEDINGS, VOLS 1 AND 2, 1996, : 145 - 148
  • [37] Surface preparation before chemical copper plating of holes in printed circuit boards. Part I
    Grigoryan, N. S.
    Savitskaya, S. A.
    Asnis, N. A.
    Bardina, O. I.
    Abrashov, A. A.
    Vagramyan, T. A.
    Dragunova, A. Yu.
    INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION, 2022, 11 (04): : 1593 - 1603
  • [38] Improved method for determining the shear strength of chip component solder joints
    Krammer, O.
    Sinkovics, B.
    MICROELECTRONICS RELIABILITY, 2010, 50 (02) : 235 - 241
  • [39] Stress analysis of printed circuit boards with highly populated solder joints and components: A micromechanics approach
    Hu, KX
    Huang, Y
    Yeh, CP
    Wyatt, KW
    JOURNAL OF ELECTRONIC PACKAGING, 1996, 118 (02) : 87 - 93
  • [40] STATION TO AUTOMATICALLY INSPECT SOLDER JOINTS ON PRINTED-CIRCUIT BOARDS (PCBS) WITH COMPUTER AIDS
    ELE, JH
    ENSMINGER, D
    VANZETTI, R
    MATERIALS EVALUATION, 1980, 38 (02) : S4 - S4
12345