Infrared solder joint inspection on surface mount printed circuit boards

被引：0
|
作者：
Liu, RZ [1 ]
Shi, YQ [1 ]
Kosonocky, WF [1 ]
Higgins, FP [1 ]
机构：
[1] AT&T COMM VAULT SYST,EATONTOWN,NJ 07724
来源：
38TH MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, PROCEEDINGS, VOLS 1 AND 2 | 1996年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：145 / 148
页数：4
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