Analysis of wafer bonding by infrared transmission

被引：0
|
作者：
Bollmann, D. [1 ]
Landesberger, Ch. [1 ]
Ramm, P. [1 ]
Haberger, K. [1 ]
机构：
[1] Fraunhofer Inst for Solid State, Technology, Munchen, Germany
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers | 1996年 / 35卷 / 07期
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页码：3807 / 3809
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