TLP diffusion bonding mechanism of Si3N4 ceramics with multiple Ti/Ni/Ti interlayers

被引：0
|
作者：
Zou, G.S. [1 ]
Wu, A.P. [1 ]
Ren, J.L. [1 ]
Ren, W.J. [1 ]
Li, S. [1 ]
机构：
[1] Dept. of Mech. Eng., Tsinghua Univ., Beijing 100084, China
来源：
Qinghua Daxue Xuebao/Journal of Tsinghua University | 2001年 / 41卷 / 04期
关键词：
Interfacial microstructure - Liquid phase diffusion bonding;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：51 / 54
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