TLP diffusion bonding mechanism of Si3N4 ceramics with multiple Ti/Ni/Ti interlayers

被引：0
|
作者：
Zou, G.S. [1 ]
Wu, A.P. [1 ]
Ren, J.L. [1 ]
Ren, W.J. [1 ]
Li, S. [1 ]
机构：
[1] Dept. of Mech. Eng., Tsinghua Univ., Beijing 100084, China
来源：
Qinghua Daxue Xuebao/Journal of Tsinghua University | 2001年 / 41卷 / 04期
关键词：
Interfacial microstructure - Liquid phase diffusion bonding;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：51 / 54
相关论文
共 50 条
  • [21] Interface diffusion and reaction between Ti layer and Si3N4/Si substrate
    Zhu, YF
    Wang, L
    Yao, WQ
    Cao, LL
    SURFACE AND INTERFACE ANALYSIS, 2001, 32 (01) : 296 - 300
  • [22] Ti/Cu/Kovar Multilayer Interlayer PTLP Diffusion Bonding Si3N4/Ht250
    Zhang, Deku
    Zhang, Lian
    Zhou, Ning
    Wang, Kehong
    Li, Xiaopeng
    CERAMICS-SWITZERLAND, 2022, 5 (03): : 372 - 388
  • [23] Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4二次部分瞬间液相连接强度
    邹家生
    许志荣
    初亚杰
    赵其章
    焊接学报, 2005, (02) : 41 - 44+7
  • [24] Diffusion bonding of SiC fiber-bonded ceramics using Ti/Mo and Ti/Cu interlayers
    Halbig, M. C.
    Asthana, R.
    Singh, M.
    CERAMICS INTERNATIONAL, 2015, 41 (02) : 2140 - 2149
  • [25] SEGREGATION OF CHROMIUM AT THE INTERFACE BETWEEN NI-CR-SI-TI BRAZING FILLER METAL AND SI3N4 CERAMICS
    CHEN, JH
    WANG, GZ
    NOGI, K
    KAMAI, M
    SATO, N
    IWAMOTO, N
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1993, 12 (02) : 87 - 89
  • [26] Wetting of Ni-Fe-Cr-Ti and Co-Ni-Fe-Cr-Ti(Si, B) system brazing fillers on Si3N4 ceramic and interfacial bonding
    2000, Chinese Academy of Sciences (36):
  • [27] Investigation of Conduction Mechanism in Ti/Si3N4/p-Si stacked RRAM
    Jung, Sunghun
    Kim, Sungjun
    Oh, Jeong-Hoon
    Ryoo, Kyung-Chang
    Lee, Jong-Ho
    Shin, Hyungcheol
    Park, Byung-Gook
    PROCEEDINGS OF THE 2013 IEEE 5TH INTERNATIONAL NANOELECTRONICS CONFERENCE (INEC), 2013, : 97 - 99
  • [28] STABILITY AND FORMATION KINETICS OF TIN AND SILICIDES IN THE TI/SI3N4 DIFFUSION COUPLE
    PAULASTO, M
    VANLOO, FJJ
    KIVILAHTI, JK
    JOURNAL DE PHYSIQUE IV, 1993, 3 (C7): : 1069 - 1072
  • [29] Si3N4/Ti/Ni/Ti/Si3N4部分瞬间液相连接接头的强度与断裂
    陈铮
    赵其章
    吴斌
    许金泉
    李志章
    眭润舟
    楼宏青
    中国有色金属学报, 1999, (S1) : 166 - 172
  • [30] Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
    张杰
    周玉
    Transactions of Nonferrous Metals Society of China, 2005, (03) : 497 - 503
12345