PARAMETRIC STUDY OF THE ETCHING OF SILICON IN SF6 MICROWAVE MULTIPOLAR PLASMAS: INTERPRETATION OF ETCHING MECHANISMS.

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作者
Petit, B. [1 ]
Pelletier, J. [1 ]
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[1] CNET, Meylan, Fr, CNET, Meylan, Fr
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页码:825 / 834
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