共 50 条
- [1] A PARAMETRIC STUDY OF THE ETCHING OF SILICON IN SF6 MICROWAVE MULTIPOLAR PLASMAS - INTERPRETATION OF ETCHING MECHANISMS JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1987, 26 (06): : 825 - 834
- [2] ANISOTROPIC ETCHING OF SILICON USING AN SF6/AR MICROWAVE MULTIPOLAR PLASMA JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1986, 4 (01): : 1 - 5
- [3] ANISOTROPIC ETCHING OF SILICON IN SF6 PLASMAS - A MODEL FOR PLASMA-ETCHING REVUE DE PHYSIQUE APPLIQUEE, 1986, 21 (06): : 377 - 399
- [5] Parametric study of the etching of SiO2 in SF6 plasmas:: Modeling of the etching kinetics and validation JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (01): : 118 - 126
- [8] TUNGSTEN ETCHING IN PULSED SF6 PLASMAS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (05): : 2970 - 2975
- [10] THE ETCHING OF SILICON IN DILUTED SF6 PLASMAS - CORRELATION BETWEEN THE FLUX OF INCIDENT SPECIES AND THE ETCHING KINETICS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (03): : 657 - 666