Predicted thermal mismatch stresses in a cylindrical bi-material assembly adhesively bonded at its ends

被引：0

作者：

Suhir, E. ^{[1
]}

机构：

[1] Bell Lab, Murray Hill, United States

来源：

Journal of Applied Mechanics, Transactions ASME | 1997年 / 64卷 / 01期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：15 / 22

共 37 条

[31] Energy release rates of bi-material interface crack including residual thermal stresses: Application of crack tip element method
Yokozeki, Tomohiro
ENGINEERING FRACTURE MECHANICS, 2010, 77 (01) : 84 - 93
[32] Predicted thermal stresses in a bow-free adhesively bonded assembly for photonic packaging applicationsPrognose thermisch induzierter Spannungen in einem verwölbungsfrei geklebten Schichtaufbau für Anwendungen im optoelektronischen Packaging
E. Suhir
e & i Elektrotechnik und Informationstechnik, 2003, 120 (6) : 195 - 199
[33] Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends
E. Suhir
R. Ghaffarian
Journal of Materials Science: Materials in Electronics, 2016, 27 : 4399 - 4409
[34] Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends
Suhir, E.
Ghaffarian, R.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (05) : 4399 - 4409
[35] Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends
Ephraim Suhir
Reza Ghaffarian
Journal of Materials Science: Materials in Electronics, 2015, 26 : 9680 - 9688
[36] Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends
Suhir, Ephraim
Ghaffarian, Reza
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (12) : 9680 - 9688
[37] Mode I tensile fracture behavior of adhesively-bonded metal-metal, metal-CFRP, and CFRP-CFRP bi-material combinations analyzed by size effect method
Qiao, Yao
Merkel, Daniel R.
Nickerson, Ethan K.
Shin, Yongsoon
Seffens, Robert J.
Ortiz, Angel
Simmons, Kevin L.
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 160

← 1 2 3 4 →