Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends

被引：5

作者：

Suhir, Ephraim ^{[1
,2
,3
]}

Ghaffarian, Reza ^{[4
]}

机构：

[1] Portland State Univ, Portland, OR 97207 USA

[2] Vienna Univ Technol, A-1060 Vienna, Austria

[3] ERS Co, Los Altos, CA 94024 USA

[4] CALTECH, Jet Prop Lab, Pasadena, CA USA

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2015年 / 26卷 / 12期

关键词：

IDENTICAL NONDEFORMABLE ADHERENDS; ADHESIVELY BONDED ASSEMBLIES; INTERFACIAL THERMAL-STRESSES; STRAINS; LAYER; EDGE;

D O I：

10.1007/s10854-015-3635-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple, easy-to-use and physically meaningful predictive model is suggested for the assessment of thermal stresses in a ball-grid-array or a column-grid-array with a low modulus solder material at the peripheral portions of the assembly. It is shown that the application of such a design can lead to a considerable relief in the interfacial stresses, even to an extent that inelastic strains in the solder joints could be avoided. If this happens, the fatigue strength of the bond and of the assembly as a whole will be improved dramatically: low-cycle fatigue conditions will be replaced by the elastic fatigue condition, and Palmgren-Minor rule of linear accumulation of damages could be used instead of one of the numerous Coffin-Manson models to assess the lifetime of the material.

引用

页码：9680 / 9688

页数：9

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Reza Ghaffarian
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