Finite element modeling of the heating of cracks during sonic infrared imaging

被引：0
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作者：
Han, Xiaoyan [1 ]
Islam, Md. Sarwar [1 ]
Newaz, G. [2 ]
Favro, L.D. [3 ]
Thomas, R.L. [4 ]
机构：
[1] Department of Electrical and Computer Engineering, Wayne State University, Detroit, MI 48202
[2] Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
[3] Institute for Manufacturing Research, Wayne State University, Detroit, MI 48202
[4] Department of Physics and Astronomy, Wayne State University, Detroit, MI 48202
来源：
Journal of Applied Physics | 2006年 / 99卷 / 07期
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