共 50 条
- [21] Routability-Driven Bump Assignment for Chip-Package Co-Design 2014 19TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2014, : 519 - 524
- [22] CHIP-PACKAGE CO-DESIGN: EFFECT OF SUBSTRATE WARPAGE ON BEOL RELIABILITY PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10, 2014,
- [23] Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [24] Novel Methodology for Assessing Chip-Package Interaction Effects on Chip Performance ISPD'22: PROCEEDINGS OF THE 2022 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2022, : 83 - 89
- [25] Co-optimization of security and accessibility to on-chip instruments 2023 IEEE 24TH LATIN AMERICAN TEST SYMPOSIUM, LATS, 2023,
- [26] Chip-Package Co-Design for Suppressing Parallel Resonance and Power Supply Noise 2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 347 - 350
- [27] RF robustness enhancement through statistical analysis of chip-package co-design 2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 1, PROCEEDINGS, 2004, : 988 - 991
- [28] Constraint driven I/O planning and placement for chip-package co-design ASP-DAC 2006: 11TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, PROCEEDINGS, 2006, : 207 - 212
- [29] Chip-package and antenna co-design of a tunable UWB transmitter in System-on-Package with on-chip versus off-chip passives ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 291 - +
- [30] Chip-Package Interaction Challenges for Large Die Applications 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 656 - 662