Effect mechanism of rare earth on the microstructures of SnAgCu solder joints

被引：0
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作者：
机构：
[1] [1,Zhang, Liang
[2] Han, Jiguang
[3] Guo, Yonghuan
[4] He, Chengwen
[5] Yuan, Jianmin
来源：
Zhang, L. (zhangliang@jsnu.edu.cn) | 1600年 / Chinese Mechanical Engineering Society卷 / 48期
关键词：
27;
D O I：
10.3901/JME.2012.24.055
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