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- [23] Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 435 - +
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- [26] Electromigration reliability of SnAgCu solder joints in WLCSP 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
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- [28] Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices Electronic Materials Letters, 2014, 10 : 645 - 647