Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin

被引：0
|
作者：
Dai, Zhen [1 ,2 ]
Li, Yanfang [2 ]
Yang, Shuguang [2 ]
Zong, Chengzhong [1 ]
Lu, Xukui [2 ]
Xu, Jian [2 ]
机构：
[1] College of Polymer Science and Engineering, Qingdao University of Science and Technology, Qingdao 266042, China
[2] State Key Laboratory of Polymer Physics and Chemistry, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100080, China
来源：
Journal of Applied Polymer Science | 2007年 / 106卷 / 03期
关键词：
Diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and 1H-NMR. 4,4′-Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass-transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：1476 / 1481
相关论文
共 50 条
  • [1] Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin
    Dai, Zhen
    Li, Yanfang
    Yang, Shuguang
    Zong, Chengzhong
    Lu, Xukui
    Xu, Jian
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2007, 106 (03) : 1476 - 1481
  • [2] Crystal Structure, Curing Kinetics, and Thermal Properties of Bisphenol Fluorene Epoxy Resin
    Xiong, Yuanqin
    Liu, Hanping
    Ou, Encai
    Zeng, Xiaoliang
    Zhou, Wei
    Xu, Weijian
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2010, 118 (02) : 827 - 833
  • [3] Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure
    Dai, Zhen
    Li, Yanfang
    Yang, Shuguang
    Zhao, Ning
    Zhang, Xiaoli
    Xu, Jian
    [J]. EUROPEAN POLYMER JOURNAL, 2009, 45 (07) : 1941 - 1948
  • [4] Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure
    Dai, Zhen
    Li, Yanfang
    Yang, Shuguang
    Zhao, Ning
    Zhang, Xiaoli
    Xu, Jian
    [J]. European Polymer Journal, 2009, 45 (07): : 1941 - 1948
  • [5] The Effect of Hyperbranched Polyester Epoxy Resin on the Curing Kinetics and Thermal Degradation Kinetics of the Diglycidyl Ether of Bisphenol-A Epoxy Resin
    Zhang, Daohong
    Chen, Sufang
    Zhou, Jiliang
    Li, Tingcheng
    Zhang, Aiqing
    [J]. POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, 2010, 49 (12) : 1182 - 1187
  • [6] Hyperbranched Polyphosphate Ester/Diglycidyl Ether of Bisphenol-A Epoxy Hybrid Resin: Preparation, Curing, and Thermal Degradation Kinetics
    Zhang, Junheng
    Chen, Sufang
    Zhang, Daohong
    Zhang, Aiqing
    [J]. JOURNAL OF POLYMER MATERIALS, 2015, 32 (02): : 127 - 138
  • [7] Renewable green reactive diluent for bisphenol a epoxy resin system: curing kinetics and properties
    Li, Jingyu
    Zhao, Haichao
    Sui, Guoxin
    [J]. RSC ADVANCES, 2022, 12 (49) : 31699 - 31710
  • [8] Investigation on curing kinetics and thermal properties of a novel epoxy resin system
    Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China
    不详
    [J]. Guti Houjian Jishu, 2007, 2 (163-165+176):
  • [9] Preparation and curing kinetics investigation of diglycidyl ether of bisphenol A/liquid crystalline epoxy resin blends
    Yang, Xiao-Wang
    Lu, Shao-Rong
    Jiang, Yu-Mei
    Zhang, Bo
    Yu, Jin-Hong
    [J]. IRANIAN POLYMER JOURNAL, 2008, 17 (04) : 251 - 264
  • [10] Kinetics of curing and thermal degradation of hyperbranched epoxy (HTDE)/diglycidyl ether of bisphenol-A epoxy hybrid resin
    Daohong Zhang
    Demin Jia
    Sufang Chen
    [J]. Journal of Thermal Analysis and Calorimetry, 2009, 98 : 819 - 824
12345