Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin

被引：0
|
作者：
Dai, Zhen [1 ,2 ]
Li, Yanfang [2 ]
Yang, Shuguang [2 ]
Zong, Chengzhong [1 ]
Lu, Xukui [2 ]
Xu, Jian [2 ]
机构：
[1] College of Polymer Science and Engineering, Qingdao University of Science and Technology, Qingdao 266042, China
[2] State Key Laboratory of Polymer Physics and Chemistry, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100080, China
来源：
Journal of Applied Polymer Science | 2007年 / 106卷 / 03期
关键词：
Diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and 1H-NMR. 4,4′-Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass-transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc;
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页码：1476 / 1481
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