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- [41] Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package 13TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, PROCEEDINGS, 2007, : 38 - +
- [42] No-bleed die attach adhesives 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 79 - 81
- [43] A REVIEW OF RECENT ADVANCES IN SOLID FILM LUBRICATION JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (02): : 212 - 219
- [49] Recent advances in thin-film microoptics OPTO-IRELAND 2005: PHOTONIC ENGINEERING, 2005, 5827 : 187 - 199