共 50 条
- [33] Novel DAF (Die Attach Film) separation technologies for ultra-thin chip 2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
- [34] A Novel Ultra-Thin Dicing Die Attach Film for Various Dicing Processes 2024 IEEE 10TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2024, 2024,
- [35] Cu wire Development for Thin QFN Package using Die Attach Film (DAF) 2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2013, : 302 - 305
- [36] Alternative Dicing Die Attach Film Method for High Volume Small Dice Application PROCEEDINGS OF THE 2010 34TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT 2010), 2011,
- [37] Alternative double pass dicing method for thin wafer laminated with die attach film 2004 IEEE International Conference on Semiconductor Electronics, Proceedings, 2004, : 636 - 641
- [38] Effect of die shape on die tilt in die attach process 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 651 - +
- [39] Effect of die attach configuration in stacked die packages PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, : 231 - 235
- [40] CSP die attach manufacturability for large thin die 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 72 - 75