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- [2] Die attach film application in multi die stack package PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 848 - 852
- [3] Assessment of Die Attach Film for Thin Die and SiP Applications IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 288 - 293
- [4] A New Thermally Conductive Thermoplastic Die Attach Film 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 212 - 215
- [6] Process and material characterization of Die attach film (DAN) for thin die applications 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 43 - 49
- [7] Die attach film performance in 3D QFN stacked die WSEAS Transactions on Applied and Theoretical Mechanics, 2008, 3 (03): : 104 - 113
- [9] Assembly cost reduction with wafer level die attach film IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1, 2007, : 7 - 9
- [10] Die Attach Film (DAF) for Breakthrough in Manufacturing (BIM) Application 2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,