共 50 条
- [42] Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 97 - 102
- [43] A goal-oriented adaptive algorithm for 3D magnetotelluric forward modeling CHINESE JOURNAL OF GEOPHYSICS-CHINESE EDITION, 2017, 60 (01): : 327 - 336
- [44] Efficient 3D Forward Modeling of GPR Scattering from Rough Ground 2015 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2015, : 1686 - 1687