Microcantilever probe cards with silicon and nickel composite micromachining technique for wafer-level burn-in testing

被引：0
|
作者：
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China [1 ]
不详 [2 ]
机构：
来源：
IEEE Trans. Adv. Packag. | / 2卷 / 468-477期
关键词：
Micromachining techniques - Micromachining technologies - Ni electroplating - Probe cards - Silicon cantilever - Single crystal silicon - Through-wafer interconnects - Wafer level;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 36 条
  • [31] Simultaneous formation of through wafer electrical interconnects and highly dense & uniform nickel tips for silicon-cantilever probe-cards
    Wang, Fei
    Li, Xinxin
    Wang, Yuelin
    Feng, Songlin
    TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007,
  • [32] Silicon-chip based electromagnetic vibration energy harvesters fabricated using wafer-level micro-casting technique
    Han, Ruofeng
    Wang, Nianying
    Wang, Jiachou
    Gu, Jiebin
    Li, Xinxin
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2021, 31 (03)
  • [33] Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing
    Bakir, Muhannad S.
    Dang, Bing
    Thacker, Hiren D.
    Ogunsola, Oluwafemi O.
    Ogra, Rohit
    Meindl, James D.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 768 - +
  • [34] SILICON-CHIP BASED ELECTROMAGNETIC VIBRATION ENERGY HARVESTERS RAPIDLY FABRICATED BY WAFER-LEVEL MOLTEN METAL MICRO-CASTING TECHNIQUE
    Han, Ruofeng
    Wang, Nianying
    Xu, Dacheng
    Gu, Jiebin
    Li, Xinxin
    2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020), 2020, : 275 - 278
  • [35] Detailed study on anodic bonding process between glass and SiNx deposited silicon substrate and its application on wafer-level AFM probe array integration
    Hsieh, GW
    Tsai, CH
    Lin, WC
    Liang, CC
    PROCEEDINGS OF THE IEEE SENSORS 2004, VOLS 1-3, 2004, : 607 - 610
  • [36] Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
    Okabe, Kenji
    Jeewan, Horagodage Prabhath
    Yamagiwa, Shota
    Kawano, Takeshi
    Ishida, Makoto
    Akita, Ippei
    SENSORS, 2015, 15 (12): : 31821 - 31832
1234