Microcantilever probe cards with silicon and nickel composite micromachining technique for wafer-level burn-in testing

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State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China [1 ]
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IEEE Trans. Adv. Packag. | / 2卷 / 468-477期
关键词：
Micromachining techniques - Micromachining technologies - Ni electroplating - Probe cards - Silicon cantilever - Single crystal silicon - Through-wafer interconnects - Wafer level;
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