共 50 条
- [41] Advancements in Space-based NUV Spectrography: Precision Fabrication and Evaluation of an Optical Slit using Optical Lithography and Deep Reactive Ion Etching SPACE TELESCOPES AND INSTRUMENTATION 2024: ULTRAVIOLET TO GAMMA RAY, PT 1, 2024, 13093
- [42] Control of sidewall slope in silicon vias using SF6/O2 plasma etching in a conventional reactive ion etching tool JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2005, 23 (05): : 2226 - 2231
- [43] CHARGE BUILDUP AND UNIFORMITY CONTROL IN MAGNETICALLY ENHANCED REACTIVE ION ETCHING USING A CURVED LATERAL MAGNETIC-FIELD JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (4B): : 2194 - 2199
- [44] Silicon nitride hardmask fabrication using a cyclic CHF3-based reactive ion etching process for vertical profile nanostructures JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2010, 28 (06): : 1179 - 1186
- [45] OPTICAL CHARACTERIZATION OF REACTIVE ION-BEAM ETCHING INDUCED DAMAGE USING GAAS ALGAAS QUANTUM-WELL STRUCTURES INSTITUTE OF PHYSICS CONFERENCE SERIES, 1990, (106): : 495 - 500
- [47] Charge build-up and uniformity control in magnetically enhanced reactive ion etching using a curved lateral magnetic field Nakagawa, Satoshi, 1600, JJAP, Minato-ku, Japan (33):
- [48] Optical emission spectrometry of plasma in low-damage sub-100 nm tungsten gate reactive ion etching process for compound semiconductor transistors Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2006, 45 (10 B): : 8364 - 8369
- [49] Optical emission spectrometry of plasma in low-damage sub-100nm tungsten gate reactive ion etching process for compound semiconductor transistors JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (10B): : 8364 - 8369
- [50] Multilayer optical read-only-memory disk applicable to blu-ray disc standard using a photopolymer sheet with a recording capacity of 100 GB Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2004, 43 (7 B): : 4983 - 4986