Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

被引：0
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作者：
Pouranvari, M. [1 ]
Ekrami, A. [1 ]
Kokabi, A.H. [1 ]
机构：
[1] Department of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, Iran
来源：
Journal of Alloys and Compounds | 2009年 / 469卷 / 1-2期
关键词：
The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy; using a Ni-Si-B interlayer; was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However; at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature; formation of borides in diffusion-affected zone is suppressed and the time required for isothermal solidification completion is increased. © 2008 Elsevier B.V. All rights reserved;
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页码：270 / 275
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