Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

被引：0
|
作者：
Pouranvari, M. [1 ]
Ekrami, A. [1 ]
Kokabi, A.H. [1 ]
机构：
[1] Department of Materials Science and Engineering, Sharif University of Technology, P.O. Box 11365-9466, Tehran, Iran
来源：
Journal of Alloys and Compounds | 2009年 / 469卷 / 1-2期
关键词：
The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy; using a Ni-Si-B interlayer; was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However; at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature; formation of borides in diffusion-affected zone is suppressed and the time required for isothermal solidification completion is increased. © 2008 Elsevier B.V. All rights reserved;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：270 / 275
相关论文
共 50 条
  • [1] Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy
    Pouranvari, M.
    Ekrami, A.
    Kokabi, A. H.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 469 (1-2) : 270 - 275
  • [2] Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy
    He, Qing
    Zhu, Dongdong
    Dong, Duo
    Xu, Mengjia
    Wang, Anpeng
    Sun, Qiancheng
    [J]. APPLIED SCIENCES-BASEL, 2019, 9 (06):
  • [3] Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10
    Yue, Xiong
    Liu, Fengmei
    Chen, Hexing
    Wan, Di
    Qin, Hongbo
    [J]. 2018 3RD INTERNATIONAL CONFERENCE ON CIVIL ENGINEERING AND MATERIALS SCIENCE (ICCEMS 2018), 2018, 206
  • [4] Influence of TLP bonding on creep deformation of a nickel-base single crystal superalloy at high temperature
    Liu, Jide
    Jin, Tao
    Wang, Zhihui
    Sun, Xiaofeng
    Guan, Hengrong
    Hu, Zhuangqi
    [J]. SUPERALLOYS 2008, 2008, : 295 - 299
  • [5] Effect of bonding variables on TLP bonding of oxide dispersion strengthened superalloy
    Saha, Ratan Kumar
    Khan, Tahir I.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2007, 42 (22) : 9187 - 9193
  • [6] Effect of bonding variables on TLP bonding of oxide dispersion strengthened superalloy
    Ratan Kumar Saha
    Tahir I. Khan
    [J]. Journal of Materials Science, 2007, 42 : 9187 - 9193
  • [7] TLP bonding of Ni-base single crystal superalloy
    Li, Wen
    Jin, Tao
    Sun, Xiaofeng
    Guo, Yi
    Guan, Hengrong
    Hu, Zhuangq
    [J]. Jinshu Xuebao/Acta Metallurgica Sinica, 2001, 37 (11): : 1165 - 1168
  • [8] TLP bonding of Ni-base single crystal superalloy
    Li, W
    Jin, T
    Sun, XF
    Guo, Y
    Guan, HR
    Hu, ZQ
    [J]. ACTA METALLURGICA SINICA, 2001, 37 (11) : 1165 - 1168
  • [9] Temperature dependence of deformation mechanism in bonding zone of TLP joint of nickel base single crystal superalloy after tensile test
    Liu, J. D.
    Jin, T.
    Zhao, N. R.
    Wang, Z. H.
    Sun, X. F.
    Guan, H. R.
    Hu, Z. Q.
    [J]. SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2007, 12 (05) : 381 - 385
  • [10] TLP bonding of cast IN718 nickel based superalloy: Process-microstructure-strength characteristics
    Pouranvari, M.
    Ekrami, A.
    Kokabi, A. H.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 568 : 76 - 82
12345