Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloy

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School of Metallurgical and Materials Engineering, Faculty of Engineering, University of Tehran, Tehran, Iran [1 ]
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Journal of Alloys and Compounds | 1600年 / 429卷 / 1-2期
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Journal article (JA)
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页码：192 / 197
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