Effect of pt and al electrodes on resistive switching properties of sputter-deposited cu-doped sio2 film

被引:0
|
作者
Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan [1 ]
机构
来源
Jpn. J. Appl. Phys. | / 1 PART 3卷
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
Silica
引用
收藏
相关论文
共 50 条
  • [41] Effect of film thickness on structural and electrical properties of sputter-deposited nickel oxide films
    Chen, HL
    Lu, YM
    Hwang, WS
    MATERIALS TRANSACTIONS, 2005, 46 (04) : 872 - 879
  • [42] DEVELOPMENT OF SPUTTER-DEPOSITED PT/AL2O3 SELECTIVE ABSORBER COATINGS
    THORNTON, JA
    LAMB, JL
    JOURNAL OF SOLAR ENERGY ENGINEERING-TRANSACTIONS OF THE ASME, 1987, 109 (04): : 241 - 252
  • [44] Influence of SiO2 Layer on Resistive Switching Properties of SiO2/CuxO Stack Structure
    Liu, Chih-Yi
    Li, Yu-Chen
    Lai, Chun-Hung
    Liu, Shih-Kun
    FUNCTIONAL AND ELECTRONIC MATERIALS, 2011, 687 : 106 - +
  • [45] SHAPE MEMORY EFFECT AND MICROSTRUCTURES OF SPUTTER-DEPOSITED Cu-Al-Ni FILMS.
    Andoh, Hisashi
    Minemura, Tetsuroh
    Ikuta, Isao
    Kita, Yoshiaki
    1600, (50):
  • [46] Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system
    Baek, Jong Tae
    Park, Hyung-Ho
    Cho, Kyung-Ik
    Yoo, Hyung Joun
    Kang, Sang Won
    Ahn, Byung Tae
    Journal of Applied Physics, 1995, 78 (12):
  • [47] Multilevel Resistive Switching Characteristics in Ag/SiO2/Pt RRAM Devices
    Yu, D.
    Liu, L. F.
    Chen, B.
    Zhang, F. F.
    Gao, B.
    Fu, Y. H.
    Liu, X. Y.
    Kang, J. F.
    Zhang, X.
    2011 INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2011,
  • [48] Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system
    Baek, JT
    Park, HH
    Cho, KI
    Yoo, HJ
    Kang, SW
    Ahn, BT
    JOURNAL OF APPLIED PHYSICS, 1995, 78 (12) : 7074 - 7079
  • [49] REACTION-KINETICS OF SPUTTER-DEPOSITED TI ON SIO2 SUBSTRATES DURING RAPID THERMAL ANNEALING
    YUN, EJ
    CHUN, HG
    JUNG, K
    KWONG, DL
    LEE, S
    RAPID THERMAL ANNEALING / CHEMICAL VAPOR DEPOSITION AND INTEGRATED PROCESSING, 1989, 146 : 255 - 260
  • [50] Properties of Cu-doped low resistive ZnSe films deposited by two-sourced evaporation
    Ali, Z
    Aqili, AKS
    Maqsood, A
    Akhtar, SMJ
    VACUUM, 2005, 80 (04) : 302 - 309