Effect of Ag content on properties of SnAgCuX lead-free solder

被引：0
|
作者：
Dong, Wenxing [1 ]
Tang, Bin [1 ]
Shi, Yaowu [1 ]
Xia, Zhidong [1 ]
机构：
[1] School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
9
引用
收藏
页码：21 / 24
相关论文
共 50 条
  • [41] Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
    Zhao Xiao-yan
    Zhao Mai-qun
    Cui Xiao-qing
    Xu Tian-han
    Tong Ming-xin
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2007, 17 (04) : 805 - 810
  • [42] Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
    赵小艳
    赵麦群
    崔小清
    许天旱
    仝明信
    Transactions of Nonferrous Metals Society of China, 2007, (04) : 805 - 810
  • [43] Effect of Addition Cobalt Nanoparticles on Sn-Ag-Cu Lead-free Solder
    Tay, S. L.
    Haseeb, A. S. M. A.
    Johan, Mohd Rafie
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 433 - 436
  • [44] Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn-Bi lead-free solder alloy
    Hu, Tianhan
    Li, Shun
    Li, Zhen
    Wu, Guanzhi
    Zhu, Ping
    Dong, Wufeng
    Sun, Yu
    Zhou, Jiayi
    Wu, Bingjia
    Zhao, Bingge
    Ding, Kai
    Gao, Yulai
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 26 : 5902 - 5909
  • [45] Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder
    Rizk Mostafa Shalaby
    Mustafa Kamal
    Esmail Abdo Mohammed Ali
    Mohammed S. Gumaan
    Silicon, 2018, 10 : 1861 - 1871
  • [46] Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder
    Shalaby, Rizk Mostafa
    Kamal, Mustafa
    Ali, Esmail Abdo Mohammed
    Gumaan, Mohammed S.
    SILICON, 2018, 10 (05) : 1861 - 1871
  • [47] An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder
    Chan, CF
    Lahiri, SK
    Yuan, P
    How, JBH
    PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 72 - 80
  • [48] Wettability of Low Silver Content Lead-Free Solder Alloy
    Dharma, I. Gusti Bagus Budi
    Shukor, Mohd Hamdi Abd
    Ariga, Tadashi
    MATERIALS TRANSACTIONS, 2009, 50 (05) : 1135 - 1138
  • [49] Investigation of the Mechanical Properties of Lead-Free Solder Materials
    Otahal, Alexandr
    Adamek, Martin
    Jansa, Vojtech
    Szendiuch, Ivan
    MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE VII, 2014, 592-593 : 453 - 456
  • [50] Modeling material properties of lead-free solder alloys
    Guo, Zhanli
    Saunders, Nigel
    Miodownik, Peter
    Schille, Jean-Philippe
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (01) : 23 - 31
12345