Effect of Ag content on properties of SnAgCuX lead-free solder

被引：0
|
作者：
Dong, Wenxing [1 ]
Tang, Bin [1 ]
Shi, Yaowu [1 ]
Xia, Zhidong [1 ]
机构：
[1] School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
9
引用
收藏
页码：21 / 24
相关论文
共 50 条
  • [31] Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy
    Shohji, Ikuo
    Arai, Ryohei
    Ishikawa, Hisao
    Kojima, Masao
    FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 2011, 462-463 : 82 - +
  • [32] Effect of thermomechanical fatigue on drop impact properties of Sn-Ag-Cu Lead-Free Solder Joints
    Kobayashi, Takayuki
    Terashima, Shinichi
    Tanaka, Masamoto
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 215 - 218
  • [33] Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder
    Wan, Jingbo
    Liu, Yongchang
    Wei, Chen
    Gao, Zhiming
    Journal of Alloys and Compounds, 2008, 463 (1-2): : 230 - 237
  • [34] Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste
    Wernicki, Evan
    Gu, Zhiyong
    THERMOCHIMICA ACTA, 2020, 690
  • [35] The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder
    Zhang, Huihui
    Xu, Zhefeng
    Wang, Yan
    Tian, Caili
    Fan, Changzeng
    Motozuka, Satoshi
    Yu, Jinku
    METALS, 2024, 14 (10)
  • [36] Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys
    Wang, Zilong
    Zhou, JiaCheng
    Liu, Fang
    Wu, Yuqin
    Yan, Nu
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2023, 35 (02) : 106 - 114
  • [37] Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder
    Liu, Xiao-Ying
    Ma, Hai-Tao
    Luo, Zhong-Bing
    Zhao, Yan-Hui
    Huang, Ming-Liang
    Wang, Lai
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2012, 22 (04): : 1169 - 1176
  • [38] Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy
    Lu, Bin
    Li, Hui
    Wang, Juan-Hui
    Zhu, Hua-Wei
    Jiao, Xian-He
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2007, 17 (04): : 518 - 524
  • [39] Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder
    Wan, Jingbo
    Liu, Yongchang
    Wei, Chen
    Gao, Zhiming
    JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 463 (1-2) : 230 - 237
  • [40] Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder
    Mitsui K.
    Yamamoto M.
    Kawai K.
    Kobayashi T.
    Shohji I.
    Watanabe H.
    Journal of Japan Institute of Electronics Packaging, 2023, 26 (03) : 266 - 274
12345