Effect of Ag content on properties of SnAgCuX lead-free solder

被引：0
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作者：
Dong, Wenxing [1 ]
Tang, Bin [1 ]
Shi, Yaowu [1 ]
Xia, Zhidong [1 ]
机构：
[1] School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 05期
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摘要：
9
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页码：21 / 24
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