Resist reflow process simulation study for contact hole pattern

被引：5
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作者：
School of Information, Communications, and Electronics Engineering, Catholic University of Korea, Bucheon 420-743, Korea, Republic of [1 ]
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来源：
J Vac Sci Technol B Microelectron Nanometer Struct | 2006年 / 1卷 / 200-204期
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10.1116/1.2155530
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