Micro flat heat pipes for microelectronics cooling: Review

被引：2
|
作者：
机构：
[1] Lv, Lu C.
[2] Li, Ji
来源：
Li, J. (jili@ucas.ac.cn) | 1600年 / Bentham Science Publishers卷 / 06期
关键词：
D O I：
10.2174/22127976113066660011
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Charging of miniature flat heat pipes
    Somasundaram, Sivanand
    Bin, He
    Mengyao, Wei
    Tan, Chuan Seng
    Wang, Evelyn N.
    HEAT AND MASS TRANSFER, 2018, 54 (10) : 3131 - 3136
  • [42] Micro and miniature heat pipes
    Vasiliev, LL
    MICROSCALE HEAT TRANSFER: FUNDAMENTALS AND APPLICATIONS, 2005, 193 : 413 - 428
  • [43] Flat micro heat pipe arrays for cooling and thermal management at the package level
    Park, JS
    Choi, JH
    Cho, HC
    Yang, SS
    Yoo, JS
    DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001, 2001, 4408 : 424 - 429
  • [44] Use of heat pipes for avionics cooling
    Zaghdoudi, MC
    Teytu, A
    PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 425 - 430
  • [45] HEAT PIPES FOR GROUND HEATING AND COOLING
    VASILIEV, LL
    HEAT RECOVERY SYSTEMS & CHP, 1988, 8 (02): : 125 - 138
  • [46] HEAT PIPES FOR COOLING OF AN ELECTRIC MOTOR
    GROLL, M
    KRAHLING, H
    MUNZEL, WD
    JOURNAL OF ENERGY, 1978, 2 (06): : 363 - 367
  • [47] The heat transport capacity of micro heat pipes
    ASME
    不详
    Journal of Heat Transfer, 1998, 120 (04): : 1064 - 1071
  • [48] The heat transport capacity of micro heat pipes
    Ha, JM
    Peterson, GP
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1998, 120 (04): : 1064 - 1071
  • [49] Prediction of the temperature field in flat plate heat pipes with micro-grooves -: Experimental validation
    Lefevre, Frederic
    Rulliere, Romuald
    Pandraud, Guillaume
    Lallemand, Monique
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (15-16) : 4083 - 4094
  • [50] Thermal performance optimization of Si micro flat heat pipes by Box-Behnken design
    Hamidnia, Mohammad
    Luo, Yi
    Wang, Xiaodong
    Jing, Gang
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (07): : 3085 - 3094
12345