Micro flat heat pipes for microelectronics cooling: Review

被引：2
|
作者：
机构：
[1] Lv, Lu C.
[2] Li, Ji
来源：
Li, J. (jili@ucas.ac.cn) | 1600年 / Bentham Science Publishers卷 / 06期
关键词：
D O I：
10.2174/22127976113066660011
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