Temperature characterization in anisotropic conductive film adhesive bonding

被引：0
|
作者：
Zenner, Robert L. D. [1 ]
Murray, Cameron T. [1 ]
Fisher, Carl [2 ]
机构：
[1] Electronics Markets Materials Division, 3M Company, 3M Center, Maplewood, MN 55144, United States
[2] Corporate Research Materials Laboratory, 3M Company, 3M Austin Center, 6801 River Place Boulevard, Austin, TX 78726, United States
来源：
Journal of Adhesion Science and Technology | 2008年 / 22卷 / 14期
关键词：
5;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：1781 / 1797
相关论文
共 50 条
  • [41] ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology
    Nagamatsu, Tatsuo
    Kakiuchi, Yuuji
    Suga, Yasuhiro
    6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007, 2007, : 119 - +
  • [42] Electrical conductive characteristics of anisotropic conductive adhesive particles
    Dou, GB
    Chan, YC
    Liu, J
    JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (04) : 609 - 616
  • [43] Laser ablation of anisotropic conductive adhesive
    Harvilchuck, LA
    Presunka, PI
    Constable, JH
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (04): : 277 - 283
  • [44] Automated optical inspection of liquid crystal display anisotropic conductive film bonding
    Ni, Guangming
    Du, Xiaohui
    Liu, Lin
    Zhang, Jing
    Liu, Juanxiu
    Liu, Yong
    OPTICAL ENGINEERING, 2016, 55 (10)
  • [45] Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
    Nakagawa, Yasutada
    Yokoyama, Ryohei
    JOURNAL OF ELECTRONIC PACKAGING, 2012, 134 (01)
  • [46] Mechanical properties of anisotropic conductive film with strain rate and temperature
    Gao, Li-Lan
    Chen, Xu
    Zhang, Shu-Bao
    Gao, Hong
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 513-14 : 216 - 221
  • [47] Random dispersion effects of conductive particles on anisotropic conductive film's (ACF's) bonding yield
    Lin, Chao-Ming
    Chi, Mao-Chieh
    Liu, Yen-Chun
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 49 - 53
  • [48] Random dispersion effects of conductive particles on anisotropic conductive film’s (ACF’s) bonding yield
    Chao-Ming Lin
    Mao-Chieh Chi
    Yen-Chun Liu
    Microsystem Technologies, 2018, 24 : 49 - 53
  • [49] Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature
    Chan, YC
    Luk, DY
    MICROELECTRONICS RELIABILITY, 2002, 42 (08) : 1185 - 1194
  • [50] Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints
    Rashed Adnan Islam
    Y. C. Chan
    B. Ralph
    Journal of Materials Research, 2004, 19 : 1662 - 1668
12345