Temperature characterization in anisotropic conductive film adhesive bonding

被引：0
|
作者：
Zenner, Robert L. D. [1 ]
Murray, Cameron T. [1 ]
Fisher, Carl [2 ]
机构：
[1] Electronics Markets Materials Division, 3M Company, 3M Center, Maplewood, MN 55144, United States
[2] Corporate Research Materials Laboratory, 3M Company, 3M Austin Center, 6801 River Place Boulevard, Austin, TX 78726, United States
来源：
Journal of Adhesion Science and Technology | 2008年 / 22卷 / 14期
关键词：
5;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
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页码：1781 / 1797
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