Chip-Last Fan-Out Pan-Level(RDL-First) Packaging (FOPLP) for Heterogeneous Integration

被引：0
|
作者：
机构：
[1] Lau, John H.
[2] Ko, Cheng-Ta
[3] Peng, Chia-Yu
[4] Yang, Kai-Ming
[5] Xia, Tim
[6] Lin, Puru Bruce
[7] Chen, Jj
[8] Huang, Po-Chun
[9] Tseng, Tzvy-Jang
[10] Lin, Eagle
[11] Chang, Leo
[12] Lin, Curry
[13] Lu, Winnie
来源：
| 1600年 / IMAPS-International Microelectronics and Packaging Society卷 / 48期
关键词：
Substrates;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for heterogeneous integration
    Lau J.H.
    Ko C.-T.
    Peng C.-Y.
    Yang K.-M.
    Xia T.
    Lin P.B.
    Chen J.-J.
    Huang P.-C.
    Tseng T.-J.
    Lin E.
    Chang L.
    Lin C.
    Lu W.
    Lau, John H. (John_Lau@unimicron.com), 1600, IMAPS-International Microelectronics and Packaging Society (17): : 89 - 98
  • [2] Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration
    Lau, John H.
    Ko, Cheng-Ta
    Yang, Kai-Ming
    Peng, Chia-Yu
    Xia, Tim
    Lin, Puru Bruce
    Chen, J. J.
    Huang, Patrick Po-Chun
    Liu, Hsing-Ning
    Tseng, Tzyy-Jang
    Lin, Eagle
    Chang, Leo
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (07): : 1125 - 1137
  • [3] Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration
    Lau, John H.
    Ko, Cheng-Ta
    Yang, Kai-Ming
    Peng, Chia-Yu
    Xia, Tim
    Lin, Puru Bruce
    Chen, J. J.
    Huang, Po-Chun
    Liu, Hsing Ning
    Tseng, Tzvy-Jang
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 339 - 347
  • [4] Reliability of Chip-Last Fan-Out Panel-Level Packaging for Heterogeneous Integration
    Lau, John H.
    Ko, Cheng-Ta
    Peng, Chia-Yu
    Yang, Kai-Ming
    Xia, Tim
    Lin, Puru Bruce
    Chen, Jean-Jou
    Huang, Po-Chun
    Tseng, Tzvy-Jang
    Lin, Eagle
    Chang, Leo
    Lin, Curry
    Fan, Yan-Jun
    Liu, Hsing-Ning
    Lu, Winnie
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 359 - 364
  • [5] An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
    Lin, Yu-Min
    Wu, Sheng-Tsai
    Shen, Wen-Wei
    Huang, Shin-Yi
    Kuo, Tzu-Ying
    Lin, Ang-Ying
    Chang, Tao-Chih
    Chang, Hsiang-Hung
    Lee, Shu-Man
    Lee, Chia-Hsin
    Su, Jay
    Liu, Xiao
    Wu, Qi
    Chen, Kuan-Neng
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 349 - 354
  • [6] Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous Integration
    Lau, John H.
    Chen, Gary Chang-Fu
    Huang, Jones Yu-Cheng
    Chou, Ricky Tsun-Sheng
    Yang, Channing Cheng-Lin
    Liu, Hsing-Ning
    Tseng, Tzvy-Jang
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 148 - 156
  • [7] An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
    Lin, Yu-Min
    Wu, Sheng-Tsai
    Wang, Chun-Min
    Lee, Chia-Hsin
    Huang, Shin-Yi
    Lin, Ang-Ying
    Chang, Tao-Chih
    Lin, Puru Bruce
    Ko, Cheng-Ta
    Chen, Yu-Hua
    Su, Jay
    Liu, Xiao
    Prenger, Luke
    Chen, Kuan-Neng
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1463 - 1469
  • [8] Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging
    Lau, John H.
    Chen, Gary Chang-Fu
    Huang, Jones Yu-Cheng
    Chou, Ricky Tsun-Sheng
    Yang, Channing Cheng-Lin
    Liu, Hsing-Ning
    Tseng, Tzyy-Jang
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (08): : 1301 - 1309
  • [9] Thermal cycling test and simulation of fan-out chip-last panel-level packaging for heterogeneous integration
    Lau J.H.
    Ko C.-T.
    Peng C.-Y.
    Yang K.-M.
    Xia T.
    Lin P.B.
    Chen J.-J.
    Huang P.-C.
    Tseng T.-J.
    Lin E.
    Chang L.
    Lin C.
    Fan Y.-J.
    Liu H.-N.
    Lu W.
    Journal of Microelectronics and Electronic Packaging, 2021, 18 (02): : 29
  • [10] RDL-1st Fan-Out Panel Level Packaging (FOPLP) for Heterogeneous and Economical Packaging
    Sekhar, Vasarla Nagendra
    Rao, Vempati Srinivasa
    Che, F. X.
    Choong, Chong Ser
    Yamamoto, Kazunori
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2126 - 2133
12345