Chip-Last Fan-Out Pan-Level(RDL-First) Packaging (FOPLP) for Heterogeneous Integration

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[1] Lau, John H.
[2] Ko, Cheng-Ta
[3] Peng, Chia-Yu
[4] Yang, Kai-Ming
[5] Xia, Tim
[6] Lin, Puru Bruce
[7] Chen, Jj
[8] Huang, Po-Chun
[9] Tseng, Tzvy-Jang
[10] Lin, Eagle
[11] Chang, Leo
[12] Lin, Curry
[13] Lu, Winnie
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| 1600年 / IMAPS-International Microelectronics and Packaging Society卷 / 48期
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