Thermal simulating analysis on the CPU heat sink with heat pipe groups

被引：0
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作者：
Li, De-Sheng [1 ]
Han, Ai-Long [1 ]
Li, Xiang [1 ]
机构：
[1] College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100022, China
来源：
Beijing Gongye Daxue Xuebao / Journal of Beijing University of Technology | 2006年 / 32卷 / 06期
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页码：485 / 488
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