Thermal simulating analysis on the CPU heat sink with heat pipe groups

被引：0
|
作者：
Li, De-Sheng [1 ]
Han, Ai-Long [1 ]
Li, Xiang [1 ]
机构：
[1] College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100022, China
来源：
Beijing Gongye Daxue Xuebao / Journal of Beijing University of Technology | 2006年 / 32卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：485 / 488
相关论文
共 50 条
  • [1] Integrated heat pipe heat sink for cooling CPU
    Bai, Minli
    Xi, Na
    Sun, Zhijun
    Li, He
    Yang, Hongwu
    Gaojishu Tongxin/Chinese High Technology Letters, 2006, 16 (07): : 713 - 717
  • [2] THERMAL ANALYSIS OF HEAT TRANSFER ENHANCEMENT OF RIB HEAT SINK FOR CPU
    Zhao, Ming
    Tian, Yang
    FRONTIERS IN HEAT AND MASS TRANSFER, 2019, 13
  • [3] Thermal analysis of high power LED package with heat pipe heat sink
    Lu, Xiang-you
    Hua, Tse-Chao
    Wang, Yan-ping
    MICROELECTRONICS JOURNAL, 2011, 42 (11) : 1257 - 1262
  • [4] Thermal analysis of an LED module with a novelly assembled heat pipe heat sink
    Tang Yong
    Chen Qiu
    Guan Wo-huan
    Li Zong-tao
    Yu Bin-hai
    Yuan Wei
    JOURNAL OF CENTRAL SOUTH UNIVERSITY, 2017, 24 (04) : 921 - 928
  • [5] Thermal analysis of an LED module with a novelly assembled heat pipe heat sink
    汤勇
    陈丘
    关沃欢
    李宗涛
    余彬海
    袁伟
    Journal of Central South University, 2017, 24 (04) : 921 - 928
  • [6] Thermal analysis of an LED module with a novelly assembled heat pipe heat sink
    Yong Tang
    Qiu Chen
    Wo-huan Guan
    Zong-tao Li
    Bin-hai Yu
    Wei Yuan
    Journal of Central South University, 2017, 24 : 921 - 928
  • [7] Low Profile Heat Pipe Heat Sink and Green Performance Characterization for Next Generation CPU Module Thermal Designs
    Vogel, Marlin
    Xu, Guoping
    Copeland, David
    Kang, Sukhvinder
    Whitney, Brad
    Meyer, George
    Kawabata, Kenya
    Conners, Matt
    26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010, 2010, : 145 - 150
  • [8] Heat spreading analysis of a heat sink base embedded with a heat pipe
    Borgmeyer, B. V.
    Ma, H. B.
    Advances in Electronic Packaging 2005, Pts A-C, 2005, : 553 - 556
  • [9] Simulating for heat pipe heat-sink of CDMA base station power module
    Tao, HZ
    Zhang, H
    Zhuang, J
    PROCEEDINGS OF THE 3RD INTERNATIONAL SYMPOSIUM ON HEAT TRANSFER ENHANCEMENT AND ENERGY CONSERVATION, VOLS 1 AND 2, 2004, : 975 - 980
  • [10] Integrated heat sink-heat pipe thermal cooling device
    Yusuf, I
    Watwe, A
    Ekhlassi, H
    ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS, 2000, : 27 - 30
12345