Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad

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作者：
Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei [1 ]
10607, Taiwan
不详 [2 ]
32093, Taiwan
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来源：
J Chin Soc Mech Eng Trans Chin Inst Eng Ser C | / 2卷 / 153-163期
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摘要：
Abrasives
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