Effects of isothermal aging on In-3Ag/Cu interface microstructure evolution characteristics

被引:0
|
作者
Ma, Yun-Zhu [1 ]
Luo, Hui-Ting [1 ]
Li, Yong-Jun [1 ]
Liu, Wen-Sheng [1 ]
Huang, Guo-Ji [1 ]
机构
[1] State Key Laboratory of Powder Metallurgy, Central South University, Changsha,410083, China
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
Ductile fracture
引用
收藏
页码:1256 / 1263
相关论文
共 50 条
  • [21] Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging
    Xin, Meiling
    Wang, Xiuqi
    Sun, Fenglian
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (33) : 25025 - 25040
  • [22] Effect of isothermal aging on microstructure, electrical resistivity and damping properties of Sn-Ag-Cu solder
    Gain, Asit Kumar
    Zhang, Liangchi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (13) : 9363 - 9370
  • [23] Effects of Ag, Mg Micro-Alloying on Aging Characteristics and Microstructure of Al-Cu-Li Alloy
    Wang Ruiqin
    Zheng Ziqiao
    Chen Yuanyuan
    Li Shichen
    Wei Xiuyu
    RARE METAL MATERIALS AND ENGINEERING, 2009, 38 (04) : 622 - 626
  • [24] Microstructure Evolution at the Solder Joint during Isothermal Aging
    Akhtar, A. M. Zetty
    Wirda, K. Hardinna
    Aisha, I. Siti Rabiatull
    Mahadzir, I.
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
  • [25] The morphology and evolution of Cu6Sn5 at the interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint during the isothermal aging
    Wang, Yaoli
    Zhang, Keke
    Li, Chenyang
    Han, Lijuan
    PHYSICAL AND NUMERICAL SIMULATION OF MATERIAL PROCESSING VI, PTS 1 AND 2, 2012, 704-705 : 685 - 689
  • [26] Effect of isothermal aging on microstructure at the interface between SnX5.0Cu1.5Ni solder and Cu substrate
    Chen, H.-Y. (gdutchy1@163.com), 1600, Editorial Office of Transactions of Materials, 18 Xueqing Road, Beijing, 100083, China (34):
  • [27] Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Xu, Ruisheng
    Liu, Yang
    Zhang, Hao
    Li, Zhao
    Sun, Fenglian
    Zhang, Guoqi
    JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (03) : 1758 - 1765
  • [28] Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Ruisheng Xu
    Yang Liu
    Hao Zhang
    Zhao Li
    Fenglian Sun
    Guoqi Zhang
    Journal of Electronic Materials, 2019, 48 : 1758 - 1765
  • [29] Effects of Cu Orientation on the Microstructure of Sn-2Ag-2.5Zn/Cu Interface
    Xu, Penghui
    Ru, Fengtian
    Ru, Anmin
    Li, Ming
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [30] Microstructure evolution and mechanical properties for rapidly solidified Cu-3Ag-0.5Zr alloy during isothermal compression
    Lv, Guoliang
    Feng, Yan
    Wang, Richu
    Peng, Chaoqun
    Wu, Xiang
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 800